AI/HPC Server

UQLEAD K03-8220

Workloads
AI training Large-scale inferencing High Performance Computing (HPC)
CPUs
Intel® Xeon® 6700 Series processors Intel® Xeon® 6500 Series processors
GPUs & Networking
NVIDIA HGX™ B200 NVIDIA ConnectX®-7 NICs NVIDIA BlueField®-3 DPUs
UQLEAD K03-8220

Your Customer Support Options

Cruise Performance Full Throttle
The incident reaction time (maximum priority) within 4 hours within 2 hours within 1 hour
Support line request resolution 9x5 24x7 24x7
Self-service request registration 24 x 7 x 365
Omnichannel support: call-center, e-mail, self-service portal
Real-time request status monitoring
Spare parts for replacement
Dedicated Service Manager
Reports 2 times a year quaterly
Updates installation remote
Root-cause analysis for critical incidents
Fixed recovery time option
Remote monitoring
View all options
Professional Support Services
Our customer support team is happy to share further details about our custom support services with you.
Datasheet
Datasheet UQLEAD K03-8220
June 2026 • Version 04
Download

Kerno UQLEAD K03-8220 overview

Ready
Intel® Xeon® 6 processors

Intel® Xeon® 6 is a generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

8 or 12
channels
PCIe 5.0
lanes
CXL 2.0
support
Up to 288
E-cores per CPU
Up to 128
P-cores per CPU
MRDIMM
support
Ready
Supports NVIDIA HGX™ B200

The NVIDIA HGX™ B200 propels the data center into a new era of accelerating computing and generative AI, integrating NVIDIA Blackwell Tensor Core GPUs with a high-speed interconnect to accelerate AI performance at scale. Configurations of eight GPUs deliver unparalleled generative AI acceleration alongside a remarkable 1.4 TB of GPU memory and 64 TB/s of memory bandwidth for 15X faster real-time trillion-parameter-model inference, 12X lower cost, and 12X less energy. This extraordinary combination positions HGX B200 as a premier accelerated x86 scale-up platform designed for the most demanding generative AI, data analytics, and HPC workloads. HGX B200 supports advanced networking options—at speeds up to 400 Gb/s—delivering the highest AI performance with NVIDIA Quantum-2 InfiniBand and the Spectrum™-X Ethernet platform. HGX B200 with NVIDIA® BlueField®-3 DPUs enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.

How Kerno Collaborates with Customers

Committed to nurturing trusted, long-term partnerships

Focused on understanding unique customer goals and requirements

Ensuring end-to-end transparency, security and compliance at every step

Enabling direct access to Kerno’s founders team

We design, manufacture, and support our servers in the UAE

First enterprise IT hardware manufacturer in the UAE

We are manufacturing enterprise-grade servers and other IT infrastructure products locally

Reduced lead time

Utilize own resilient supply chain and local component warehouse

Minimal Response Time

Leverage Kerno's fully local customer support team based in the UAE

Local R&D and Engineering Team

Offering engineering excellence to your business in the UAE

Proprietary Intellectual Property (IP) Rights

Fully owned by Kerno

PCBA manufacturing & fully automated unit assembly line

Designed locally at Kerno's own manufacturing facility

Feature
Specifications
Dimensions

8U (W447 x H351 x D923 mm)

CPU

Intel® Xeon® 6 processors:

  • Intel® Xeon® 6700 Series processors
  • Intel® Xeon® 6500 Series processors

Dual processors, TDP up to 350W

Operating system compatibility

Windows Server 2022 
Windows Server 2025
Red Hat Enterprise Linux server 9.6 x64
Red Hat Enterprise Linux server 9.7 x64
Red Hat Enterprise Linux server 10.0 x64
Red Hat Enterprise Linux server 10.1 x64
SUSE Linux Enterprise server 15 SP6 
SUSE Linux Enterprise server 15 SP7
SUSE Linux Enterprise server 16
Ubuntu 22.04 LTS x64
Ubuntu 24.04 LTS x64
Citrix Hypervisor 8.2 LTSR CU1
XenServer 8.4
VMware ESXi 8.0 Update 3e
VMware ESXi 9.0 
VMware ESXi 9.0.1
VMware ESXi 9.0.2

Chipset

System on Chip

Memory

32 x DIMMs

8-channel DDR5 RDIMM/MRDIMM

For RDIMM: up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
For MRDIMM: up to 8000 MT/s* 

*MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.

LAN

Front:
2 x 10 Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Rear:
1 x 10/100/1000 Mb/s Management LAN

*When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in ASPEED® AST2600:

  • 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4
1 x M.2 (2280/22110), PCIe Gen5 x2

Modular GPU

NVIDIA HGX B200 with 8 x SXM GPUs

PCIe expansion slots

4 x FHHL dual-slot PCIe Gen5 x16
8 x FHHL single-slot PCIe Gen5 x16

I/O ports

Front:
2 x USB 3.2 Gen1, 1 x VGA, 2 x RJ45, 1 x MLAN
Rear:
1 x MLAN

Security modules

TPM 2.0

Power supply

6+6 3000 W 80 PLUS Titanium redundant power supply

AC Input:

  • 115-127V~/ 14.2A, 50-60Hz
  • 200-220V~/ 15.8A, 50-60Hz
  • 220-240V~/ 14.9A, 50-60Hz

DC Input (only for China):

  • 240Vdc/ 14A

DC Output:

  • Max 1450W/ 115-127V~
    +54V/ 26.6A
    +12Vsb/ 3A
  • Max 2900W/ 200-220V~
    +54V/ 53.4A
    +12Vsb/ 3A
  • Max 3002.4W/ 220-240V~ or 240Vdc Input
    +54V/ 55.6A
    +12Vsb/ 3A

*The system power supply requires C19 power cord.

System management

ASPEED® AST2600 Baseboard Management Controller
KERNO Management Console web interface

System fans

Motherboard: 2 x 60x60x56 mm / 4 x 60x60x76 mm
OSFP ports: 4 x 40x40x56 mm
PCIe slots: 2 x 80x80x56 mm
GPU tray: 15 x 80x80x80 mm

Operating properties

Operating: 10°C to 30°C, 8% to 80% (non-condensing)
Non-operating: -40°C to 60°C, 20% to 95% (non-condensing)

Packaging content

1 x 8U chassis
1 x L-shape rail kit

Warranty

3- to 5-year limited warranty

We look forward to understanding your goals & requirements