8U (W447 x H351 x D923 mm)
| Cruise | Performance | Full Throttle | |
|---|---|---|---|
| The incident reaction time (maximum priority) | within 4 hours | within 2 hours | within 1 hour |
| Support line request resolution | 9x5 | 24x7 | 24x7 |
| Self-service request registration 24 x 7 x 365 | |||
| Omnichannel support: call-center, e-mail, self-service portal | |||
| Real-time request status monitoring | |||
| Spare parts for replacement | |||
| Dedicated Service Manager | |||
| Reports | 2 times a year | quaterly | |
| Updates installation | remote | ||
| Root-cause analysis for critical incidents | |||
| Fixed recovery time option | |||
| Remote monitoring |
Intel® Xeon® 6 is a generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.
The NVIDIA HGX™ B200 propels the data center into a new era of accelerating computing and generative AI, integrating NVIDIA Blackwell Tensor Core GPUs with a high-speed interconnect to accelerate AI performance at scale. Configurations of eight GPUs deliver unparalleled generative AI acceleration alongside a remarkable 1.4 TB of GPU memory and 64 TB/s of memory bandwidth for 15X faster real-time trillion-parameter-model inference, 12X lower cost, and 12X less energy. This extraordinary combination positions HGX B200 as a premier accelerated x86 scale-up platform designed for the most demanding generative AI, data analytics, and HPC workloads. HGX B200 supports advanced networking options—at speeds up to 400 Gb/s—delivering the highest AI performance with NVIDIA Quantum-2 InfiniBand and the Spectrum™-X Ethernet platform. HGX B200 with NVIDIA® BlueField®-3 DPUs enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.
Committed to nurturing trusted, long-term partnerships
Focused on understanding unique customer goals and requirements
Ensuring end-to-end transparency, security and compliance at every step
Enabling direct access to Kerno’s founders team
First enterprise IT hardware manufacturer in the UAE
We are manufacturing enterprise-grade servers and other IT infrastructure products locally
Reduced lead time
Utilize own resilient supply chain and local component warehouse
Minimal Response Time
Leverage Kerno's fully local customer support team based in the UAE
Local R&D and Engineering Team
Offering engineering excellence to your business in the UAE
Proprietary Intellectual Property (IP) Rights
Fully owned by Kerno
PCBA manufacturing & fully automated unit assembly line
Designed locally at Kerno's own manufacturing facility
8U (W447 x H351 x D923 mm)
Intel® Xeon® 6 processors:
Dual processors, TDP up to 350W
Windows Server 2022
Windows Server 2025
Red Hat Enterprise Linux server 9.6 x64
Red Hat Enterprise Linux server 9.7 x64
Red Hat Enterprise Linux server 10.0 x64
Red Hat Enterprise Linux server 10.1 x64
SUSE Linux Enterprise server 15 SP6
SUSE Linux Enterprise server 15 SP7
SUSE Linux Enterprise server 16
Ubuntu 22.04 LTS x64
Ubuntu 24.04 LTS x64
Citrix Hypervisor 8.2 LTSR CU1
XenServer 8.4
VMware ESXi 8.0 Update 3e
VMware ESXi 9.0
VMware ESXi 9.0.1
VMware ESXi 9.0.2
System on Chip
32 x DIMMs
8-channel DDR5 RDIMM/MRDIMM
For RDIMM: up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
For MRDIMM: up to 8000 MT/s*
*MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.
Front:
2 x 10 Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
Rear:
1 x 10/100/1000 Mb/s Management LAN
Integrated in ASPEED® AST2600:
Front hot-swap:
8 x 2.5" Gen5 NVMe
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4
1 x M.2 (2280/22110), PCIe Gen5 x2
NVIDIA HGX™ B200 with 8 x SXM GPUs
4 x FHHL dual-slot PCIe Gen5 x16
8 x FHHL single-slot PCIe Gen5 x16
Front:
2 x USB 3.2 Gen1, 1 x VGA, 2 x RJ45, 1 x MLAN
Rear:
1 x MLAN
TPM 2.0
6+6 3000 W 80 PLUS Titanium redundant power supply
AC Input:
DC Input (only for China):
DC Output:
*The system power supply requires C19 power cord.
ASPEED® AST2600 Baseboard Management Controller
KERNO Management Console web interface
Motherboard: 2 x 60x60x56 mm / 4 x 60x60x76 mm
OSFP ports: 4 x 40x40x56 mm
PCIe slots: 2 x 80x80x56 mm
GPU tray: 15 x 80x80x80 mm
Operating: 10°C to 30°C, 8% to 80% (non-condensing)
Non-operating: -40°C to 60°C, 20% to 95% (non-condensing)
1 x 8U chassis
1 x L-shape rail kit
3- to 5-year limited warranty
We look forward to understanding your goals & requirements